Non-conductive end layer for integrated stack of IC chips

Details Non-conductive end layer for integrated stack of IC chips Non-conductive end layer for integrated stack of IC chips

1994-04-25

1995-06-13

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361744, 361792, 257686, 257704, 257777, H05K 700

Patent

active

054249201

ABSTRACT:
An integrated stack of layers incorporating a plurality of IC chip layers has an end layer which is formed of dielectric material (or covered with such material). The outer surface of the end layer provides a substantial area for the spaced location of a multiplicity of lead-out terminals, to which exterior circuitry can be readily connected. In the preferred embodiment, each lead-out terminal on the outer surface of the end layer is connected to IC circuitry embedded in the stack by means of conducting material in a hole through the end layer, and a conductor (trace) on the inner surface of the end layer which extends from the hole to the edge of the end layer, where it is connected by a T-connect to metalization on the access plane face of the stack.

REFERENCES:
patent: 2907926 (1959-10-01), Slack
patent: 4794092 (1988-12-01), Solomon
patent: 4953005 (1990-08-01), Carlson et al.
patent: 5104820 (1992-04-01), Go

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