Non-conductive and self-leveling leadframe clamp insert for wire

Details Non-conductive and self-leveling leadframe clamp insert for wire Non-conductive and self-leveling leadframe clamp insert for wire

1999-07-09

2000-10-31

Ryan, Patrick

Metal fusion bonding

Including means to force or clamp work portions together...

Work portion comprises electrical component

228 45, 228 55, 228212, 269316, 269317, B23K 3704, B23Q 306

Patent

active

061388912

ABSTRACT:
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

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