Non-conductive and self-leveling leadframe clamp insert for wire

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

228 11, 228 55, 228 447, 228212, 269316, 269317, B23K 3700, B23K 106, B23K 522, B23Q 300

Patent

active

061058467

ABSTRACT:
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

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