Non-conductive and self-leveling leadframe clamp insert for wire

Details Non-conductive and self-leveling leadframe clamp insert for wire Non-conductive and self-leveling leadframe clamp insert for wire

1999-07-09

2000-08-22

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 11, 228 55, 228 447, 228212, 269316, 269317, B23K 3700, B23K 106, B23K 522, B23Q 300

Patent

active

061058467

ABSTRACT:
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

REFERENCES:
patent: 3566207 (1971-02-01), Adams
patent: 3685137 (1972-08-01), Gardiner
patent: 4030657 (1977-06-01), Scheffer
patent: 4361261 (1982-11-01), Elles et al.
patent: 4434347 (1984-02-01), Kurtz et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4603803 (1986-08-01), Chan et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4765531 (1988-08-01), Ricketson et al.
patent: 4778097 (1988-10-01), Hauser
patent: 4821945 (1989-04-01), Chase et al.
patent: 5035034 (1991-07-01), Cotney
patent: 5043534 (1991-08-01), Mahulikar et al.
patent: 5066614 (1991-11-01), Dunaway et al.
patent: 5114066 (1992-05-01), Amador et al.
patent: 5148959 (1992-09-01), Cain et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5197652 (1993-03-01), Yamazaki
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5233131 (1993-08-01), Liang et al.
patent: 5307978 (1994-05-01), Ricketson et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5328870 (1994-07-01), Marrs
patent: 5336272 (1994-08-01), Tsutsumi et al.
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5384155 (1995-01-01), Abbott et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5445306 (1995-08-01), Huddleston
patent: 5465899 (1995-11-01), Quick et al.
patent: 5611478 (1997-03-01), Asanasavest
patent: 5647528 (1997-07-01), Ball et al.
patent: 5659201 (1997-08-01), Wollesen
patent: 5673479 (1997-10-01), Hawthorne
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5877555 (1999-03-01), Leighton et al.
patent: 5890644 (1999-04-01), Ball
patent: 5891377 (1999-04-01), Libres et al.
patent: 5923538 (1999-07-01), Hawthorne
patent: 5954842 (1999-09-01), Fogal et al.
H.K. Charles; "Electrical Interconnection"; pp. 224-236.

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