Non-conductive and self-leveling leadframe clamp insert for...

Details Non-conductive and self-leveling leadframe clamp insert for... Non-conductive and self-leveling leadframe clamp insert for...

2005-07-26

2005-07-26

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

With clamping or holding

C228S004500, C228S044700, C228S180500

Reexamination Certificate

active

06921017

ABSTRACT:
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

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H.K. Charles; “Electrical Interconnection”; pps. 224-236, (no date).
US 2002/0043548 A1 Evers et al. (Apr. 18, 2002).

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