Non-bleeding thixotropic thermally conductive material

Details Non-bleeding thixotropic thermally conductive material Non-bleeding thixotropic thermally conductive material

1979-08-16

1981-05-05

Pitlick, Harris A.

Compositions

Fluent dielectric

Si-containing

252 28, 252 75, H01B 346, H01B 320, H01B 310

Patent

active

042657750

ABSTRACT:
A non-bleeding thixotropic thermally conductive material finding particular use for enhancing the cooling ability of electrical components which comprises a silicone liquid carrier, a thermal filler powder of lamellar or dendritic shape and silica fibers.

REFERENCES:
patent: 2428608 (1947-10-01), Bass
patent: 3405066 (1968-10-01), McGhee et al.
patent: 3882033 (1975-05-01), Wright

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