Non-aqueous, non-corrosive microelectronic cleaning...

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

Reexamination Certificate

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Details

C510S176000, C134S001300

Reexamination Certificate

active

07951764

ABSTRACT:
Back end photoresist strippers and cleaning compositions of this invention are provided by amino acid-free, non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor compound with multiple hydroxyl functional groups that is a compound of the formula:in-line-formulae description="In-line Formulae" end="lead"?T1-[(CR1R2)m—(CR3R4)n]p—(CR5R6)q-T2in-line-formulae description="In-line Formulae" end="tail"?where at least one of R1and R2OH and if one of R1and R2is not OH, it is selected from H, alkyl or alkoxy, m is a whole integer of 1 or greater, R3and R4are selected from H, alkyl or alkoxy, n is 0 or a greater whole positive integer, p is a whole integer of 1 or greater; at least one of R5and R6is OH and if one of R5and R6is not OH, it is selected from H, alkyl or alkoxy, q is a whole integer of 1 or greater; T1and T2are selected from H, alkyl, hydroxyalkyl, polyhydroxyalkyl, aminoalkyl, carbonylalkyl or amide groups or T1and T2may be connected forming a structure selected from an aliphatic cyclic or fused cyclic structure.

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