Non-aqueous electrolytic aluminum plating bath composition

Details Non-aqueous electrolytic aluminum plating bath composition Non-aqueous electrolytic aluminum plating bath composition

1990-06-18

1991-12-24

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Utilizing nonaqueous bath

C25D 344

Patent

active

050749730

ABSTRACT:
There is disclosed a non-aqueous electrolytic aluminum plating bath composition comprising an aluminum halide and a nitrogen-containing heterocyclic onium halide compound and containing an additive selected from the group consisting of an inorganic halide compound, aromatic aldehyde, ketone or carboxylic acid, an unsaturated heterocyclic compound containing more than one nitrogen atom, an unsaturated heterocyclic compound containing a sulfur atom, an aromatic hydrocarbon compound containing a sulfur atom, an aromatic hydrocarbon compound containing an amino group and an aromatic amine; and further optionally an organic polymer. The bath composition is easy in maintenance, has good covering power, and enables smooth plating with low current density.

REFERENCES:
patent: 2446331 (1948-08-01), Hurley
patent: 2446349 (1948-08-01), Wier
patent: 2446350 (1948-08-01), Wier
patent: 4747916 (1988-05-01), Kato
patent: 4966660 (1990-10-01), Setsuko

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