Non-aqueous, adhesive-free method of bonding expanded polymeric

Details Non-aqueous, adhesive-free method of bonding expanded polymeric Non-aqueous, adhesive-free method of bonding expanded polymeric

1995-05-19

1997-09-16

Choi, Kathleen

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562722, 264413, 264432, B32B 3124

Patent

active

056676212

ABSTRACT:
Bonding of expanded polymeric parts together to produce lost foam molds suitable for casting metallic details is accomplished by applying a non-aqueous, adhesive-free coating comprising a polar, highly dielectric component contained in a liquid vehicle to the interfacing surface of at least one of the parts to be joined. The interfacing surfaces of the parts to be joined are held in contact while the assembly is irradiated with high frequency electromagnetic energy. This energy enables the coating to dielectrically heat the mated expanded polymeric parts until a bond is effected by melting the polymeric parts and inducing expansion of the parts into one another.

REFERENCES:
patent: 4018642 (1977-04-01), Pike et al.
patent: 4035216 (1977-07-01), Immel
patent: 4253898 (1981-03-01), Rinker et al.
patent: 5462627 (1995-10-01), Oldham et al.

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