Nodular copper/nickel alloy treatment for copper foil

Details Nodular copper/nickel alloy treatment for copper foil Nodular copper/nickel alloy treatment for copper foil

1997-06-24

1998-09-01

Gorgos, Kathryn L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

205104, 205111, 428612, 428675, 428687, 428935, B32B 1520, C25D 518

Patent

active

058009302

ABSTRACT:
There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper
ickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 1750092 (1930-03-01), Crawford et al.
patent: 1969553 (1934-08-01), Gernes
patent: 3247082 (1966-04-01), Rose
patent: 3454376 (1969-07-01), Luce et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3833481 (1974-09-01), Olson et al.
patent: 3857683 (1974-12-01), Castonguay
patent: 4131517 (1978-12-01), Mitsuo et al.
patent: 4167459 (1979-09-01), Lee et al.
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4199417 (1980-04-01), Borruso
patent: 4387006 (1983-06-01), Kajiwara et al.
patent: 4394419 (1983-07-01), Konicek
patent: 4468293 (1984-08-01), Polan et al.
patent: 4483906 (1984-11-01), Nakatsugawa
patent: 4515671 (1985-05-01), Polan et al.
patent: 4549941 (1985-10-01), Parthasarathi et al.
patent: 4552627 (1985-11-01), Parthasarathi
patent: 4568431 (1986-02-01), Polan et al.
patent: 4619871 (1986-10-01), Takami
patent: 4689475 (1987-08-01), Kleiner et al.
patent: 4756795 (1988-07-01), Bakos et al.
patent: 4789438 (1988-12-01), Polan
patent: 4888574 (1989-12-01), Rice et al.
patent: 5019222 (1991-05-01), Hino et al.
patent: 5114543 (1992-05-01), Kajiwara et al.
patent: 5230932 (1993-07-01), Chen et al.
patent: 5234573 (1993-08-01), Takami
patent: 5304428 (1994-04-01), Takami
patent: 5320919 (1994-06-01), Azuma et al.
Anonymous, Electroplated Copper Foil, Research Disclosure, No. 199, Nov. 1980, Article No. 19901, pp. 435-436.
Abner Brenner, Electrodeposition of Alloys, Principles and Practice, vol. I, Academic Press, New York, 1963, month of publication not available pp. 558-562.

Affiliated with

Also associated with

Rating

Nodular copper/nickel alloy treatment for copper foil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nodular copper/nickel alloy treatment for copper foil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nodular copper/nickel alloy treatment for copper foil will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-268255