No fixture method to cure die attach for bonding IC dies to subs

Details No fixture method to cure die attach for bonding IC dies to subs No fixture method to cure die attach for bonding IC dies to subs

1995-06-07

1998-01-13

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 438455, H01R 4300

Patent

active

057065772

ABSTRACT:
A no fixture method to cure die attach for bonding IC dies (16) to substrates in which a solvent is applied to top and bottom surfaces of a thermoplastic die attach film (14), prior to component placement of the die (16) on a lead frame die support pad or on a printed circuit board PCB (12). The die attach film (14) is bonded to the IC die (16) and the lead frame, or to the IC die (16) and the printed circuit board PCB (12) upon drying of the solvent.

REFERENCES:
patent: 5006575 (1991-04-01), Chan
patent: 5057900 (1991-10-01), Yamazaki
patent: 5204399 (1993-04-01), Edelman
patent: 5205036 (1993-04-01), Yamazaki
patent: 5225023 (1993-07-01), Wojnarowski et al.
patent: 5348607 (1994-09-01), Wojnarowski et al.
patent: 5371328 (1994-12-01), Gutierrez et al.
IBM Technical Disclosure Bulletin vol. 34 No. 2 Jul. 1991 pp. 181-182.

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