No-clean solder paste vehicle

Metal treatment – Compositions – Fluxing

Patent

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Details

148 25, B23K 3534

Patent

active

050644823

ABSTRACT:
A paste vehicle for use in a metal bearing solder paste composition having a heat-polymerizable binder is provided. This vehicle can be non-aqueous, inorganic salt-free and dispersed in a non-aqueous, organic liquid, and may be incorporated with a flux into a solder paste composition capable of utilizing an average particle size finer than 100 mesh. This paste has excellent anti-slump properties, requires no cleanup to remove residual solder reflow, and permits smaller more controlled joints to be formed.

REFERENCES:
patent: 3162551 (1964-12-01), Short
patent: 3171734 (1965-03-01), Benson
patent: 3697333 (1972-10-01), Hoefflern
patent: 4325754 (1982-04-01), Mizuhara
patent: 4557768 (1985-12-01), Barringer
patent: 4701224 (1987-10-01), Zado

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