No-clean, low-residue, volatile organic compound free soldering

Details No-clean, low-residue, volatile organic compound free soldering No-clean, low-residue, volatile organic compound free soldering

1993-02-05

1994-01-25

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 24, 148 25, B23K 3534

Patent

active

052812812

ABSTRACT:
A no-clean, low-residue, rosin-free soldering flux is described which comprises a solvent consisting essentially of demineralized water present in amount of at least about 95% by weight based on total weight of the soldering flux; from about 1% to about 4% by weight based on total weight of the soldering flux of a fluxing agent consisting essentially of at least two carboxylic acids selected from the group consisting of C.sub.2 -C.sub.10 dicarboxylic acids, monocarboxylic acids and hydroxy acids, said fluxing agent being present as solute in said deionized water solvent; and nonionic surfactant present in an amount of less than about 1% by weight based on total weight of soldering flux.

REFERENCES:
patent: 3424625 (1969-01-01), Tlegel
patent: 4478650 (1984-10-01), Zado
patent: 4601763 (1986-07-01), Stratil et al.
patent: 4708751 (1987-11-01), Froebel
patent: 5085365 (1992-02-01), Turner

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