No-bond integrated circuit inputs

Details No-bond integrated circuit inputs No-bond integrated circuit inputs

1995-11-22

1997-10-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257773, 257784, 257786, 257379, H07L 23495

Patent

active

056751788

ABSTRACT:
A method and means for use when doing multiple products on an IC die and it becomes necessary to no-bond a control or address input thus requiring the connection of this IC input to a voltage of the proper polarity. In such a situation, an unused input pad is selectively bonded to a supply leadframe finger and connected to suitable logic to pull the unconnected IC input to the proper voltage. An embodiment whereby problems with noisy input voltages can be readily overcome is also described.

REFERENCES:
patent: 5229846 (1993-07-01), Kozuka
patent: 5264727 (1993-11-01), Kudou et al.
patent: 5289040 (1994-02-01), Rogers
patent: 5455460 (1995-10-01), Hongo et al.

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