Nitride semiconductor laser device and fabricating method...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

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C438S022000

Reexamination Certificate

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07056756

ABSTRACT:
A method for fabricating a nitride semiconductor laser device including a step to expose surfaces of an n-type nitride semiconductor layer (102) and a p-type nitride semiconductor layer (108); a step to cover the surface of the multi-layered semiconductor; with an insulating film (109) that has a thickness greater than the difference in levels between the exposed surface of the n-type nitride semiconductor layer (102) and the outermost surface of the p-type nitride semiconductor layer (108); a step to flatten the surface of the insulating film (109); and a step to form an n-type electrode (111) and a p-type electrode (110) electrically connected to the n-type nitride semiconductor layer (102) and the p-type nitride semiconductor layer (108), respectively. This method makes it possible to obtain a nitride semiconductor laser device that is highly reliable and exhibits an excellent heat diffusing property.

REFERENCES:
patent: 5422901 (1995-06-01), Lebby et al.
patent: 6761303 (2004-07-01), Ozawa
patent: 6770960 (2004-08-01), Oohata
patent: 6815790 (2004-11-01), Bui et al.
patent: 2001/0002917 (2001-06-01), Ozawa
patent: 10-163536 (1998-06-01), None
patent: 10-223930 (1998-08-01), None
patent: P2000-244012 (2000-09-01), None
patent: P2001-168442 (2001-06-01), None
Machine Translation of JP 2000-233012 (original published Sep. 8, 2000).

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