Nitride semiconductor device having a zinc-based substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular semiconductor material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S013000, C257S021000, C257S091000, C257S094000, C257SE33025, C257SE33028, C257SE33030, C257SE33033, C257SE33034

Reexamination Certificate

active

07977703

ABSTRACT:
A nitride semiconductor device includes a semiconductor substrate; a first nitride semiconductor layer provided on the semiconductor substrate; a mask layer having opening portions, provided on the first nitride semiconductor layer; a second nitride semiconductor layer selectively grown on the mask layer laterally from the opening portions; and a semiconductor lamination portion formed by laminating nitride semiconductor layers so as to form a semiconductor element on the second nitride semiconductor layer. The substrate may be made of a zinc-based compound, the first nitride semiconductor layer may be provided on, and in contact with, the substrate, and at least a substrate side of the first nitride semiconductor layer may be made of AlyGa1-yN (0.05≦y≦0.2). Additionally, the semiconductor element may be a light emitting layer in which case the mask layer may include a metal film provided on the first nitride semiconductor layer and an insulating film provided on the metal film.

REFERENCES:
patent: 5932327 (1999-08-01), Inoguchi et al.
patent: 6015979 (2000-01-01), Sugiura et al.
patent: 6147364 (2000-11-01), Itaya et al.
patent: 6252261 (2001-06-01), Usui et al.
patent: 6312967 (2001-11-01), Ikeda
patent: 6475882 (2002-11-01), Sakai et al.
patent: 6549552 (2003-04-01), Omi et al.
patent: 6566231 (2003-05-01), Ogawa et al.
patent: 6627520 (2003-09-01), Kozaki et al.
patent: 6711192 (2004-03-01), Chikuma et al.
patent: 6765233 (2004-07-01), Tsuda et al.
patent: 6784462 (2004-08-01), Schubert
patent: 6821804 (2004-11-01), Thibeault et al.
patent: 6838704 (2005-01-01), Lin et al.
patent: 6849864 (2005-02-01), Nagahama et al.
patent: 6863943 (2005-03-01), Wang et al.
patent: 6891268 (2005-05-01), Tomiya et al.
patent: 7049635 (2006-05-01), Sano et al.
patent: 7053420 (2006-05-01), Tadatomo et al.
patent: 7102174 (2006-09-01), Hideyoshi et al.
patent: 7148514 (2006-12-01), Seo et al.
patent: 7170097 (2007-01-01), Edmond et al.
patent: 7187007 (2007-03-01), Kim et al.
patent: 7279751 (2007-10-01), Ueda et al.
patent: 7442254 (2008-10-01), Kiyoku et al.
patent: 7646027 (2010-01-01), Bandoh
patent: 2002/0001864 (2002-01-01), Ishikawa et al.
patent: 2002/0057053 (2002-05-01), Hitoshi
patent: 2002/0066403 (2002-06-01), Sunakawa et al.
patent: 2003/0234404 (2003-12-01), Matsuoka et al.
patent: 2003/0235226 (2003-12-01), Ueki
patent: 2005/0145840 (2005-07-01), Kato et al.
patent: 2006/0273339 (2006-12-01), Steigerwald et al.
patent: 2007/0241352 (2007-10-01), Yasuda et al.
patent: 2007/0295981 (2007-12-01), Erchak et al.
patent: 2008/0048194 (2008-02-01), Kudo et al.
patent: 2008/0230780 (2008-09-01), Urashima
patent: 06-061527 (1994-03-01), None
patent: 10-173222 (1998-06-01), None
patent: 2003-174228 (2003-06-01), None
patent: 2005-236260 (2005-09-01), None
patent: 2005-305596 (2007-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Nitride semiconductor device having a zinc-based substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nitride semiconductor device having a zinc-based substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nitride semiconductor device having a zinc-based substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2639524

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.