Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2006-03-17
2010-12-28
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C438S042000, C438S044000
Reexamination Certificate
active
07858414
ABSTRACT:
A method of manufacturing a nitride semiconductor device includes the steps of forming a groove on a surface of a first substrate by scribing, and forming a nitride semiconductor layer on the surface where the groove is formed. In addition, the method includes the steps of bonding the nitride semiconductor layer and a second substrate together and separating the nitride semiconductor layer and the first substrate from each other. With this manufacturing method, a nitride semiconductor device can be obtained with high yield.
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Fudeta Mayuko
Komada Satoshi
Lee Jae
Morrison & Foerster / LLP
Richards N Drew
Sharp Kabushiki Kaisha
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