Nitride semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S192000, C257SE29246, C257SE29253

Reexamination Certificate

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07635877

ABSTRACT:
A nitride semiconductor device including an ohmic electrode with low contact resistance and manufacturing method thereof including a first nitride semiconductor layer made of a III-V group nitride semiconductor layer deposited on a substrate, a second nitride semiconductor layer including the III-V group nitride semiconductor layer whose film formation temperature is lower than that of the first nitride semiconductor layer and being deposited on the first nitride semiconductor layer and not including aluminum. An ohmic electrode is then formed through forming a metal pattern making ohmic contact on the second nitride semiconductor layer being unprocessed crystallinity with minute grains, and then heat treating the metal pattern.

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