Nitride semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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Details

C257S103000, C257S029000, C257S029000, C257S029000, C438S167000, C438S172000

Reexamination Certificate

active

07352017

ABSTRACT:
A nitride semiconductor device enabiling to supress current collapse and manufacturing method thereof including a III-V group nitride semiconductor layer formed of III group elements includes at least one element from the group consisting of gallium, aluminum, boron and indium, and V group elements including at least nitrogen from the group consisting of nitrogen, phosphorous and arsenic, comprising a first nitride semiconductor layer made of said III-V group nitride semiconductor layer deposited on a substrate, a second nitride semiconductor layer comprising said III-V group nitride semiconductor layer and a control electrode making Schottky contact with the first nitride semiconductor layer being exposed through removing a portion of the second semiconductor layer.

REFERENCES:
patent: 2003/0203604 (2003-10-01), Makita
patent: 10-335637 (1998-12-01), None
Y. Ohno, et al.; “International Conference on Nitride Semiconductor, Nara, 2003, Tu-P2. 067” (p. 375).

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