Nitride heterojunction transistors having charge-transfer...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257SE29251

Reexamination Certificate

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10772882

ABSTRACT:
A nitride-based field effect transistor includes a substrate, a channel layer comprising InAlGaN formed on the substrate, source and drain ohmic contacts in electrical communication with the channel layer, and a gate contact formed on the channel layer. At least one energy barrier opposes movement of carriers away from the channel layer. The energy barrier may comprise an electron source layer in proximity with a hole source layer which generate an associated electric field directed away from the channel. An energy barrier according to some embodiments may provide a built-in potential barrier in excess of about 0.5 eV. Method embodiments are also disclosed.

REFERENCES:
patent: 4424525 (1984-01-01), Mimura
patent: 4471366 (1984-09-01), Delagebeaudeuf et al.
patent: 4727403 (1988-02-01), Hilda et al.
patent: 4755867 (1988-07-01), Cheng
patent: 4788156 (1988-11-01), Stoneham et al.
patent: 4946547 (1990-08-01), Palmour et al.
patent: 5053348 (1991-10-01), Mishra et al.
patent: 5172197 (1992-12-01), Nguyen et al.
patent: 5192987 (1993-03-01), Khan et al.
patent: 5200022 (1993-04-01), Kong et al.
patent: 5210051 (1993-05-01), Carter, Jr.
patent: 5292501 (1994-03-01), Degenhardt et al.
patent: 5296395 (1994-03-01), Khan et al.
patent: 5298445 (1994-03-01), Asano
patent: RE34861 (1995-02-01), Davis et al.
patent: 5389571 (1995-02-01), Takeuchi et al.
patent: 5393993 (1995-02-01), Edmond et al.
patent: 5523589 (1996-06-01), Edmond et al.
patent: 5534462 (1996-07-01), Fiordalice et al.
patent: 5592501 (1997-01-01), Edmond et al.
patent: 5686737 (1997-11-01), Allen
patent: 5700714 (1997-12-01), Ogihara et al.
patent: 5701019 (1997-12-01), Matsumoto et al.
patent: 5705827 (1998-01-01), Baba et al.
patent: 5804482 (1998-09-01), Konstantinov et al.
patent: 5885860 (1999-03-01), Weitzel et al.
patent: 5946547 (1999-08-01), Kim et al.
patent: 5990531 (1999-11-01), Taskar et al.
patent: 6028328 (2000-02-01), Riechert et al.
patent: 6046464 (2000-04-01), Schetzina
patent: 6064082 (2000-05-01), Kawai et al.
patent: 6086673 (2000-07-01), Molnar
patent: 6150680 (2000-11-01), Eastman et al.
patent: 6177685 (2001-01-01), Teraguchi et al.
patent: 6218680 (2001-04-01), Carter, Jr. et al.
patent: 6316793 (2001-11-01), Sheppard
patent: 6429467 (2002-08-01), Ando
patent: 6448648 (2002-09-01), Boos
patent: 6492669 (2002-12-01), Nakayama et al.
patent: 6515316 (2003-02-01), Wojtowicz et al.
patent: 6548333 (2003-04-01), Smith
patent: 6586781 (2003-07-01), Wu et al.
patent: 6639255 (2003-10-01), Inoue et al.
patent: 2001/0015446 (2001-08-01), Inoue et al.
patent: 2001/0020700 (2001-09-01), Inoue et al.
patent: 2001/0023964 (2001-09-01), Wu et al.
patent: 2001/0040246 (2001-11-01), Ishii
patent: 2002/0008241 (2002-01-01), Edmond et al.
patent: 2002/0017696 (2002-02-01), Nakayama et al.
patent: 2002/0066908 (2002-06-01), Smith
patent: 2002/0079508 (2002-06-01), Yoshida
patent: 2002/0119610 (2002-08-01), Nishii et al.
patent: 2002/0167023 (2002-11-01), Chavarkar et al.
patent: 2003/0017683 (2003-01-01), Emrick et al.
patent: 2003/0020092 (2003-01-01), Parikh et al.
patent: 2003/0102482 (2003-06-01), Saxler
patent: 2003/0123829 (2003-07-01), Taylor
patent: 2003/0145784 (2003-08-01), Thompson et al.
patent: 2003/0157776 (2003-08-01), Smith
patent: 2003/0213975 (2003-11-01), Hirose et al.
patent: 2004/0004223 (2004-01-01), Nagahama et al.
patent: 2004/0021152 (2004-02-01), Nguyen et al.
patent: 2004/0029330 (2004-02-01), Hussain et al.
patent: 2004/0066908 (2004-04-01), Saxler et al.
patent: 2004/0241970 (2004-12-01), Ring
patent: 0 334 006 (1989-09-01), None
patent: 0 563 847 (1993-10-01), None
patent: 10-050982 (1998-02-01), None
patent: 11261053 (1999-09-01), None
patent: 02001230407 (2001-08-01), None
patent: 02002016087 (2002-01-01), None
patent: 2004-342810 (2004-12-01), None
patent: WO 93/23877 (1993-11-01), None
patent: WO 01/57929 (2001-08-01), None
patent: WO 03/049193 (2003-06-01), None
patent: 2004/008495 (2004-01-01), None
patent: 2004/008495 (2004-01-01), None
Adeside et al “A1GaN/GaN . . . Applications”, Proc. 6th Int. Conf. Solid-State and Int. Cir. Tech. vol. 2 pp. 1163-1168 Oct. 22-25, 2001.
Chen et al, “High-Transconductance . . . MOVPE”, IEEE Elec. Dev. Lett. vol. 10 No. 4 Apr. 1989, pp. 162-164.
Wang et al, “Modfet . . . Effects”, IEEE Trans. Elec. Dev. vol. 36 No. 9 Sep. 1989, pp. 1847-1850.
Asbeck et al. “Piezoelectric charge densities in A1GaN/GaN HFETs,”Electronics Letters. vol. 33, No. 14, pp. 1230-1231, 1997.
Eastman et al. “GaN materials for high power microwave amplifiers,”Mat. Res. Soc. Symp. Proc. vol. 512 (1998).
Eastman et al. “Undoped A1GaN/GaN HEMTs for Microwave Power Amplification,”IEEE Transactions on Electron Devices. vol. 48, No. 3, Mar. 2001, pp. 479-485.
Gaska et al. “Electron Transport in A1GaN-GaN Heterostructures Grown on 6H-SiC Substrates,” Appl.Phys.Lett., 72, 707 (1998).
Gaska et al. “High-Temperature Performance of A1GaN/GaN HFET's on SiC Substrates,”IEEE Electron Device Letters. vol. 18; No. 1, p. 492, Oct. 1997.
Gelmont et al. “Monte Carlo simulation of electron transport in gallium nitride,” J.Appl.Phys. 74, 1818 (1993).
Heikman et al., Growth of Fe-Doped Semi-insulating GaN by Metalorganic Chemical Vapor Deposition, Appl. Phys. Let. 81, pp. 439-441 (2002).
Ping et al. “DC and Microwave Performance of High-Current A1GaN/GaN Heterostructure Field Effect Transistors Grown on P-Type SiC Substrates,”IEEE Electron Letters. vol. 19, No. 2, p. 54, Feb. 1998.
Sheppard et al. “High Power Demonstration at 10 GHz with GaN/A1GaN HEMT Hybrid Amplifiers.” Presented at the 58thDRC, Denver, CO, Jun. 2000.
Sheppard et al. “Improved 10-GHz Operation of GaN/A1GaN HEMTs on Silicon Carbide,”Materials Science Forum. (2000) vols. 338-342, pp. 1643-1646.
Sheppard et al. U.S. Appl. No. 09/096,967, entitled,Nitride Based Transistors On Semi-Insulating Silicon Carbide Substrates, filed Jun. 12, 1998.
Sullivan et al. “High-Power 10-GHz Operation of A1GaN HFET's in Insulating SiC,”IEEE Electron Device Letters. vol. 19, No. 6, p. 198, Jun. 1998.
Wu et al. “High A1-Content A1GaN/GaN MODFET's for Ultrahigh Performance,”IEEE Electron Device Letters. vol. 19, No. 2, p. 50, Feb. 1998.
Yu et al. “Schottky barrier engineering in III-V nitrides via the piezoelectric effect,”Applied Physics Letters. vol. 73, No. 13, pp. 1880-1882, Sep. 28, 1998.
International Search Report for PCT/US02/09398, Aug. 26, 2002.
United States Patent Application entitled “Co-Doping for Fermi Level Control in Semi-Insulating Group III Nitrides”, filed Jan. 7, 2004.
Ben-Yaacov et al., “A1GaN/GaN Current Aperture Vertical Electron Transistors with Regrown Channels,”Journal of Applied Physics. vol. 95, No. 4, pp. 2073-2078 (2004).
Burm et al. “Ultra-Low Resistive Ohmic Contacts on n-GaN Using Si Implantation,”Applied Physics Letters. vol. 70, No. 4, 464-66 (1997).
Heikman, et al., “Mass Transport Regrowth of GaN for Ohmic Contacts to A1GaN/GaN,”Applied Physics Letters. vol. 78, No. 19, pp. 2876.
Shen et al., “High-Power Polarization-Engineered GaN/A1GaN/GaN HEMTs Without Surface Passivation,”IEEE Electronics Device Letters. vol. 25, No. 1, pp. 7-9 (2004).
United States Patent Application entitled “Nitride-Based Transistors with a Protective Layer and a Low-Damage Recess and Methods of Fabrication Thereof,” U.S. Appl. No. 10/758,871, filed Jan. 16, 2004.
United States Patent Application entitled “Semiconductor Devices Having a Hybrid Channel Layer, Current Aperture Transistors and Methods of Fabricating the Same,” U.S. Appl. No. 10/849,589, filed May 20, 2004.
United States Patent Application entitled “Methods of Fabricating Nitride-Based Transistors Having Regrown Ohmic Contact Regions and Nitride-Based Transistors Having Regrown Ohmic Contact Regions,” U.S. Appl. No. 10/849,617, filed May 20, 2004.
United St

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