Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2006-10-17
2008-11-25
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C228S179100, C228S180100, C228S180210
Reexamination Certificate
active
07456438
ABSTRACT:
A nitride-based semiconductor LED which is flip-chip bonded on a lead pattern of a sub-mount through a bump ball comprises a substrate; a light-emitting structure formed on the substrate; an electrode formed on the light-emitting structure; a protective film formed on the resulting structure having the electrode formed therein, the protective film exposing the electrode surface corresponding to a portion which is connected to the lead pattern of the sub-mount through a bump ball; and a grid-shape buffer film formed on the electrode surface exposed through the protective film.
REFERENCES:
patent: 6331450 (2001-12-01), Uemura
patent: 7196000 (2007-03-01), Lee et al.
patent: 1635634 (2005-07-01), None
patent: 1659713 (2005-08-01), None
patent: 5-90329 (1993-04-01), None
patent: 10-2005-0029602 (2005-03-01), None
Kim Chang Wan
Kim Yong Chun
Lee Hyuk Min
Shin Hyoun Soo
McDermott Will & Emery LLP
Patton Paul E
Samsung Electro-Mechanics Co., ltd.
Smith Zandra
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