Nitride-based semiconductor element

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With particular semiconductor material

Reexamination Certificate

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C257S631000, C257S622000, C257SE21113, C257SE33043

Reexamination Certificate

active

07109530

ABSTRACT:
A nitride-based semiconductor element having excellent element characteristics is obtained by fabricating a nitride-based semiconductor layer having excellent crystallinity without performing extended etching. The nitride-based semiconductor element comprises a mask layer, having a recess portion, formed on a substantially flat upper surface of an underlayer to partially expose the upper surface of the underlayer, a nitride-based semiconductor layer formed on the exposed part of the underlayer and the mask layer while forming a void on the recess portion of the mask layer, and a nitride-based semiconductor element layer, formed on the nitride-based semiconductor layer, having an element region. During laterally growth, strain is relaxed thereby improving crystallinity. The underlayer is formed in a substantially flat shape, thereby avoiding extended etching.

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patent: 6503769 (2003-01-01), Nakamura et al.
patent: 2002/0117104 (2002-08-01), Hata et al.
patent: 10-312971 (1998-11-01), None
patent: 2000-21789 (2000-01-01), None
patent: 2000-164989 (2000-06-01), None
patent: 2000-269144 (2000-09-01), None
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Akira Usui et al., “Thick GaN Epitaxial Growth with Low Dislocation Density by Hydride Vapor Phase Epitaxy”, Jpn. J. Appl. Phys. vol. 36 (1997), pp. L899-L902.
Kevin Linthicum et al., “Pendeoepitaxy of gallium nitride thin films”, Applied Physics Letter, vol. 75, No. 2, Jul. 12, 1999, pp. 196-198.
Isao Kidoguchi et al., “Air-bridged lateral epitaxial overgrowth of GaN thin films”, Applied Physics Letter, vol. 76, No. 25, Jun. 19, 2000, pp. 3768-3770.

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