Nitride-based semiconductor device and method of fabricating...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S022000, C438S706000

Reexamination Certificate

active

06890779

ABSTRACT:
A method of fabricating a nitride-based semiconductor device capable of reducing contact resistance between a nitrogen face of a nitride-based semiconductor substrate or the like and an electrode is provided. This method of fabricating a nitride-based semiconductor device comprises steps of etching the back surface of a first semiconductor layer consisting of either an n-type nitride-based semiconductor layer or a nitride-based semiconductor substrate having a wurtzite structure and thereafter forming an n-side electrode on the etched back surface of the first semiconductor layer.

REFERENCES:
patent: 5493577 (1996-02-01), Choquette et al.
patent: 6242761 (2001-06-01), Fujimoto et al.
patent: 6399966 (2002-06-01), Tsuda et al.
patent: 6455340 (2002-09-01), Chua et al.
patent: 6515308 (2003-02-01), Kneissl et al.
patent: 09-129930 (1997-05-01), None
patent: P2002-26438 (2002-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Nitride-based semiconductor device and method of fabricating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nitride-based semiconductor device and method of fabricating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nitride-based semiconductor device and method of fabricating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3367202

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.