Nitride based LED with a p-type injection region

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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C257S081000, C257S095000, C257S099000, C257S100000

Reexamination Certificate

active

07420218

ABSTRACT:
An LED chip (2) is composed of a p-GaN layer (10), an n-GaN layer (14), and an MQW emission layer (12) that is sandwiched between the GaN layers (10and14). Each layer is made of a GaN semiconductor. Light exits the LED chip (2) through the n-GaN layer (14). A p-electrode (16) of the LED chip (2) has a surface profile (24B) defined by a plurality of columnar projections (24A) formed in a uniformly distributed relation on the surface facing toward the p-GaN layer (10). The p-electrode (16) is in contact with the p-GaN layer (10) at the top surface of each projection (24A).

REFERENCES:
patent: 6222207 (2001-04-01), Carter-Coman et al.
patent: 6316785 (2001-11-01), Nunoue et al.
patent: 2004/0031956 (2004-02-01), Saxler
patent: 11-330552 (1999-11-01), None
patent: 2003-110138 (2003-04-01), None
Yamada, Motokazu et al; InGaN-Based Near-Ultraviolet and Blue-Light-Emitting Diodes with High External Quantum Efficiency Using a Patterned Sapphire Substrate and a Mesh Electrode; Jpn. J. Appl. Phys vol. 41 (2002) pp. L1431-L1433, Part 2, No. 12B, Dec. 15, 2002, The Japan Society of Applied Physics.

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