Nickel-X/gold/nickel-X conductors for solid state devices where

Details Nickel-X/gold/nickel-X conductors for solid state devices where Nickel-X/gold/nickel-X conductors for solid state devices where

1979-12-17

1981-05-19

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

29604, 357 67, 357 71, 427 88, 427 89, 427 92, 428621, 428622, 428632, 428672, 428680, 428929, B32B 1500, B05D 512

Patent

active

042685842

ABSTRACT:
A laminated conductor includes a lower thin film of nickel-X alloy or pseudo alloy deposited upon a substrate containing silicon or upon a substrate intended for use as a magnetic bubble storage device. Upon the film of nickel-X alloy, a thicker film of gold is deposited as the conductive portion of the conductor. On the upper surface of the gold layer is deposited a thin film of nickel-X alloy. Failure of the conductor because of electromigration is reduced dramatically as compared with use of molybdenum instead of nickel in the laminated structure. The nonmagnetic nickel-X alloy does not interfere with magnetic fields or produce unwanted magnetic fields.

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patent: 3970433 (1976-07-01), Warmka et al.
patent: 4013803 (1977-03-01), Josephs
patent: 4017890 (1977-04-01), Howard et al.
patent: 4166279 (1979-08-01), Gangulee et al.

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