Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1985-08-19
1987-04-07
Niebling, John F.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204 29, 204 371, 204 40, C25D 538
Patent
active
046558845
ABSTRACT:
An improved method of depositing nickel on a clean refractory metal surface to form a multilayer article is disclosed, wherein the full thickness of nickel can be plated prior to the intermetallic bonding of the metals. The metal surface is cleaned and etched prior to the application of a first layer of nickel on the surface by electroplating means. After the article is rinsed, a second layer of nickel is applied to the first layer of nickel by electroplating means. The article is then heated in the absence of air to cause intermetallic bonding between nickel and the refractory metal substrate.
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Hills Stanley
Landon James K.
Amgott Allen E.
General Electric Company
Leader William T.
Niebling John F.
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