Nickel plating method

Coating processes – Electrical product produced – Photoelectric

Patent

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Details

427 92, 4273763, 4274431, H01L 21288, C23C 300

Patent

active

043212832

ABSTRACT:
A simple method for plating nickel onto silicon which renders unnecessary any catalyzing pretreatment of the silicon surface which is to receive the nickel. The method comprises the immersion of a silicon substrate in a suitable nickel bath in order that nickel ions in the bath will be reduced to solid nickel and deposited onto the substrate so as to form an adhering layer thereon. The method is especially advantageous in plating nickel onto silicon shallow junction devices for the purpose of providing ohmic contacts.

REFERENCES:
patent: 3489603 (1970-01-01), Darter et al.
patent: 4152824 (1979-05-01), Gunsiorawski

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