Nickel plating bath

Details Nickel plating bath Nickel plating bath

1986-01-10

1987-10-13

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

204 381, 204 447, 204 49, C25D 312

Patent

active

046996958

ABSTRACT:
A nickel bath for electroplating aluminum and aluminum alloys with nickel is comprised of high proportions of nickel sulfate, small proportions of an acid which stabilizes the pH values, and very small proportions of a fluoride which loosens the oxide layer appearing in the Licer bath, of a chloride which promotes the dissolution of the nickel anodes and of a phosphite which improves the adhesive strength of the nickel layer.
The solids are kept in suspension in the bath by vigorous circulation, for example by means of air. The particle size should preferably be 3 micrometers.

REFERENCES:
patent: 2473163 (1949-06-01), McCoy
patent: 2694019 (1954-11-01), Gutzeit
patent: 2774688 (1956-12-01), Girard
patent: 3284323 (1966-11-01), Leloup
patent: 3531379 (1970-09-01), Peach
patent: 3634209 (1972-01-01), Wolf et al.
patent: 3726771 (1973-04-01), Coll-Palagos
Chemical Abstracts, vol. 72, p. 424, 17797z, (1970).
R. S. Vakhidov et al., Elektrokhimiya, vol. 12, No. 6, pp. 989-991, Jun. 1976.
Rieger, Chemical Abstracts 101(1984), #160149 (Abstract of Germ. Offen. DE 3246323.

Affiliated with

Also associated with

Rating

Nickel plating bath does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nickel plating bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nickel plating bath will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-409858