Nickel plating

Details Nickel plating Nickel plating

1977-11-30

1979-07-03

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 312

Patent

active

041599268

ABSTRACT:
A nickel electroplating bath comprises in aqueous solution at a pH of from 4 to 7, nickel ions at a Molar concentration of at least 0.25, chloride ions at a Molar concentration of at least 0.25, and a weak complexant for the nickel selected from formate, acetate, citrate, glutamate, anions and lactones of sugar acids and anions and lactones of acids having the formula X(C.sub.n H.sub.2n)COOH where X is OH or NH.sub.2 and n is 1 to 5, preferably 1 to 2, present at a Molar concentration of from 0.5 to 4.0 times that of the nickel. These baths have good throwing power and can be operated at convenient temperatures and pH values and at lower nickel ion concentrations than hitherto.

REFERENCES:
patent: 2449422 (1948-09-01), Smith
patent: 2726969 (1955-12-01), Spaulding
patent: 2782152 (1957-02-01), DuRose et al.
patent: 3062666 (1962-11-01), McLeod
patent: 3417005 (1968-12-01), Baig
patent: 3620936 (1971-11-01), DeCastelet
patent: 3901773 (1975-08-01), Lugwig
H. Koretzky, IBM Tech. Disclosure Bulletin, p. 1634, vol. 9, No. 11, Apr. 1967.

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