Nickel particle plating system

Details Nickel particle plating system Nickel particle plating system

1988-05-26

1989-08-15

Rutledge, L. DeWayne

Compositions

Electrically conductive or emissive compositions

Free metal containing

252512, 252514, 428570, H01B 116, H01B 122

Patent

active

048572330

ABSTRACT:
A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the shpere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.

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"Electroless Copper Plating", Modern Electroplating, F. Lowenstein, 3d Edition, pp. 734-739.

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