Nickel-gold-nickel conductors for solid state devices

Details Nickel-gold-nickel conductors for solid state devices Nickel-gold-nickel conductors for solid state devices

1979-12-17

1982-03-09

James, Andrew J.

357 65, 357 68, 357 67, H01L 2348, H01L 2946, H01L 2954

Patent

active

043192645

ABSTRACT:
A laminated conductor includes a lower thin film of nickel deposited upon a substrate containing silicon. Upon the film of nickel, a thicker film of gold is deposited as the conductive portion of the conductor. On the upper surface of the gold layer is deposited a thin film of nickel. Failure of the conductor because of electromigration is reduced dramatically as compared with use of molybdenum instead of nickel in the laminated structure.

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