Nickel electroplating solution and acetylenic compounds therefor

Details Nickel electroplating solution and acetylenic compounds therefor Nickel electroplating solution and acetylenic compounds therefor

1990-11-05

1992-11-17

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

106 119, 205275, 205278, C25D 316

Patent

active

051640694

ABSTRACT:
An aqueous acid electroplating solution comprising nickel ions and one or more acetylenic compounds, specifically mono- and polyglyceryl ethers of acetylenic alcohols; acetylenic compounds useful in the electroplating solution; and processes using such solution and compounds. The invention is particularly useful for nickel plating an irregular surface such as a printed circuit board having through-holes.

REFERENCES:
patent: 3634207 (1972-01-01), Toledo
patent: 3804727 (1974-04-01), Lyde
patent: 3839465 (1974-10-01), Schneider et al.

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