Nickel electroplating solution

Details Nickel electroplating solution Nickel electroplating solution

2005-02-08

2005-02-08

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S271000, C106S001270

Reexamination Certificate

active

06852211

ABSTRACT:
Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.

REFERENCES:
patent: 3617343 (1971-11-01), Kandler et al.
patent: 3672940 (1972-06-01), Funada et al.
patent: 4421611 (1983-12-01), Cameron
patent: 20030196906 (2003-10-01), Kondo et al.
patent: 1408748 (1975-10-01), None
References A, B and N were cited on the European Search Report.

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