Nickel diffusion bonded to metallized ceramic body and method

Details Nickel diffusion bonded to metallized ceramic body and method Nickel diffusion bonded to metallized ceramic body and method

1986-02-05

1987-05-12

Smith, John D.

Coating processes

Electrical product produced

Welding electrode

134 1, 427 96, 427 98, 427 99, 427252, 427253, 427305, H05K 310

Patent

active

046649425

ABSTRACT:
Packless cementation is used to diffusion bond nickel to discrete exposed areas of tungsten or molybdenum that are in turn bonded to the surface of a ceramic body, e.g. in the preparation of a ceramic chip carrier or other premetallized ceramic device.

REFERENCES:
patent: 3061463 (1962-10-01), Samuel
patent: 4407860 (1983-10-01), Fleming
patent: 4442137 (1984-04-01), Kumar
patent: 4518624 (1985-05-01), Park et al.
patent: 4526859 (1985-07-01), Christensen
patent: 4590095 (1986-05-01), Park

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