Nickel coating diffusion bonded to metallized ceramic body and c

Details Nickel coating diffusion bonded to metallized ceramic body and c Nickel coating diffusion bonded to metallized ceramic body and c

1985-06-03

1986-05-20

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427252, 427253, H05K 310

Patent

active

045900957

ABSTRACT:
Pack cementation is used to diffusion bond substantially pore-free nickel to discrete exposed areas of tungsten or molybdenum that are in turn bonded to the surface of a ceramic body, e.g. in the preparation of a ceramic chip carrier.

REFERENCES:
patent: 3061462 (1962-10-01), Samuel
patent: 3198659 (1965-08-01), Levy
patent: 4407860 (1983-10-01), Fleming
patent: 4474838 (1984-10-01), Halecky
patent: 4526859 (1985-07-01), Christensen
Kaiser et al., "A Fabrication Technique for Multilayer Ceramic Modules", Solid State Technology, May 1972, pp. 35-40.
Baudrand, "Electroless Nickel Plating on Metallized Ceramic", Plating & Surface Finishing, Sep. 1981, pp. 67-70.
Haddad et al., "Depositing Crack-Free Heavy Electroless Nickel Coating" IBM TDB vol. 20, No. 8, Jan. 1978.

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