Nickel clad corrosion resistant lid for semiconductor package

Details Nickel clad corrosion resistant lid for semiconductor package Nickel clad corrosion resistant lid for semiconductor package

1986-12-22

1988-04-12

Beck, Shrive P.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428678, 428679, 427125, 427284, 427360, 427438, 228190, 228208, 228209, B32B 1501

Patent

active

047374187

ABSTRACT:
A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.

REFERENCES:
patent: 3364064 (1968-01-01), Wijburg
patent: 4243729 (1981-01-01), Hascoe
patent: 4601958 (1986-07-01), Levine
patent: 4620661 (1986-11-01), Slatterly

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