Nickel bonding cap over copper metalized bondpads

Details Nickel bonding cap over copper metalized bondpads Nickel bonding cap over copper metalized bondpads

2006-06-27

2006-06-27

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S766000

Reexamination Certificate

active

07067924

ABSTRACT:
A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.

REFERENCES:
patent: 3599060 (1971-08-01), Triggs et al.
patent: 5869126 (1999-02-01), Kukanskis
patent: 6259161 (2001-07-01), Wu et al.
patent: 6593221 (2003-07-01), Lindgren
patent: 6781234 (2004-08-01), Hayashida
patent: 2004/0186008 (2004-09-01), Inoue et al.
Donald W. Baudrand, Use of Electroless Nickel To Reduce Gold Requirements, Plating and Surfacing Finishing, pp. 57-60, (Dec. 1981).

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