Nickel based material for a semiconductor apparatus

Details Nickel based material for a semiconductor apparatus Nickel based material for a semiconductor apparatus

1989-05-01

1990-11-13

Hille, Rolf

357 70, H01L 2354, H01L 2352

Patent

active

049705695

ABSTRACT:
A nickel based material for a semiconductor apparatus is provided which includes between 0.5 and 5% of at least one material selected from the group consisting of cobalt, iron, aluminum, manganese, silicon, carbon, and copper; residual nickel; and unavoidable impurties. With this nickel based material, electrical conductivity thereof can be maintained within a proper value and the plate film adhesion in silver plating nickel based products can be improved remarkably and both heat dissipation capacity and the coefficient of thermal expansion can be improved.

REFERENCES:
patent: 3217401 (1965-11-01), White
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4607276 (1986-08-01), Butt
"Mitsubishi Metal Products Catalog", Mitsubishi Denki Kabushiki Kaisha, Catalog Number P-C2000-AsA8512, Dec. 1985.
Betteridge, W., "Nickel and Its Alloys", Chichester, England, Ellis Horwood Ltd., 1984, pp. 63, 64.

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