Nickel alloy plated structure

Details Nickel alloy plated structure Nickel alloy plated structure

2007-10-30

2007-10-30

Zimmerman, John J. (Department: 1775)

Printing

Stenciling

Stencils

C101S127000, C428S596000, C428S675000, C216S012000

Reexamination Certificate

active

10908883

ABSTRACT:
A structure and associated methods of formation. The structure includes a layered configuration comprising a copper layer, a first layer, and a second layer. The copper layer consists essentially of copper. The first and second layers are disposed on opposite sides of the copper layer and are in direct mechanical contact with the copper layer. The first and second layers each consist essentially of a same alloy of nickel and cobalt having a weight percent concentration of cobalt in a range of 3% to 21%. A through hole in the layered configuration extends completely through the first layer, the copper layer, and the second layer, wherein a first opening in the layered configuration extends completely through the first layer and does not extend into any portion of the second layer.

REFERENCES:
patent: 2065654 (1936-12-01), Claisse
patent: 5049221 (1991-09-01), Wada et al.
patent: 6287896 (2001-09-01), Yeh et al.

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