NEXT high frequency improvement using hybrid substrates of...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C361S766000

Reexamination Certificate

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07459640

ABSTRACT:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.

REFERENCES:
patent: 5396397 (1995-03-01), McClanahan et al.
patent: 5700167 (1997-12-01), Pharney et al.
patent: 5915989 (1999-06-01), Adriaenssens et al.
patent: 5997358 (1999-12-01), Adriaenssens et al.
patent: 6042427 (2000-03-01), Adriaenssens et al.
patent: 6050843 (2000-04-01), Adriaenssens et al.
patent: 6057743 (2000-05-01), Aekins
patent: 6089923 (2000-07-01), Phommachanh
patent: 6168474 (2001-01-01), German et al.
patent: 6215372 (2001-04-01), Novak
patent: 6270381 (2001-08-01), Adriaenssens et al.
patent: 6353540 (2002-03-01), Narizuka et al.
patent: 6379157 (2002-04-01), Curry et al.
patent: 6441314 (2002-08-01), Rokugawa et al.
patent: 6483715 (2002-11-01), Chen
patent: 6509779 (2003-01-01), Yue et al.
patent: 6528145 (2003-03-01), Berger et al.
patent: 6533618 (2003-03-01), Aekins
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6563058 (2003-05-01), Mizutani et al.
patent: 6603668 (2003-08-01), Iwanami
patent: 6663946 (2003-12-01), Seri et al.
patent: 6678144 (2004-01-01), Higashi et al.
patent: RE38519 (2004-05-01), Doorhy et al.
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6799989 (2004-10-01), Doorhy et al.
patent: 6865090 (2005-03-01), Wajima et al.
patent: 6923673 (2005-08-01), Doorhy et al.
patent: 6972893 (2005-12-01), Chen et al.
patent: 6984886 (2006-01-01), Ahn et al.
patent: 7013561 (2006-03-01), Nakatani et al.
patent: 7114985 (2006-10-01), Doorhy et al.
patent: 7153168 (2006-12-01), Caveney et al.
patent: 7179131 (2007-02-01), Caveney et al.
patent: 7182649 (2007-02-01), Caveney et al.
patent: 7190594 (2007-03-01), Hashim et al.
patent: 7252554 (2007-08-01), Caveney et al.
patent: 7265300 (2007-09-01), Adriaenssens et al.
patent: 7309261 (2007-12-01), Caveney et al.
patent: 2001/0048592 (2001-12-01), Ninomiya
patent: 2002/0088977 (2002-07-01), Mori
patent: 2002/0195270 (2002-12-01), Okubora et al.
patent: 2003/0024732 (2003-02-01), Ninomiya
patent: 2003/0075356 (2003-04-01), Horie
patent: 2003/0174484 (2003-09-01), Pai et al.
patent: 2003/0218870 (2003-11-01), Fisher et al.
patent: 2004/0040740 (2004-03-01), Nakatani et al.
patent: 2004/0147165 (2004-07-01), Celella et al.
patent: 2005/0199422 (2005-09-01), Hashim et al.
patent: 2005/0254223 (2005-11-01), Hashim et al.
patent: 2007/0173120 (2007-07-01), Caveney et al.
patent: 1 059 704 (2000-12-01), None
patent: WO 03/019734 (2003-03-01), None
Ragu Natarajan and J.P. Dougherty, “Material Compatibility and Dielectric Properties of Co-Fired High and Low Dielectric Constant Cermanic Packages,” IEEE 1997 Electronic Components and Technology Conference.
Gary D. Alley, “Interdigital Capacitors and Their Application to Lumped-Element Microwave Integrated Circuits”, IEEE Transactions on Microwave Theory and Techniques, (1970), vol. 18, No. 12, p. 1028-1033.

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