Next high frequency improvement by using frequency dependent...

Details Next high frequency improvement by using frequency dependent... Next high frequency improvement by using frequency dependent...

2011-07-19

2011-07-19

Gushi, Ross N (Department: 2833)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

C439S941000

Reexamination Certificate

active

07980900

ABSTRACT:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

REFERENCES:
patent: 5396397 (1995-03-01), McClanahan et al.
patent: 5700167 (1997-12-01), Pharney et al.
patent: 5915989 (1999-06-01), Adriaenssens et al.
patent: 5931703 (1999-08-01), Aekins
patent: 5997358 (1999-12-01), Adriaenssens et al.
patent: 6042427 (2000-03-01), Adriaenssens et al.
patent: 6050843 (2000-04-01), Adriaenssens et al.
patent: 6057743 (2000-05-01), Aekins
patent: 6089923 (2000-07-01), Phommachanh
patent: 6165018 (2000-12-01), Arnett et al.
patent: 6168474 (2001-01-01), German et al.
patent: 6215372 (2001-04-01), Novak
patent: 6250968 (2001-06-01), Winings
patent: 6270381 (2001-08-01), Adriaenssens et al.
patent: 6346010 (2002-02-01), Emplit
patent: 6353540 (2002-03-01), Narizuka et al.
patent: 6356162 (2002-03-01), DeFlandre et al.
patent: 6379157 (2002-04-01), Curry et al.
patent: 6428362 (2002-08-01), Phommachanh
patent: 6441314 (2002-08-01), Rokugawa et al.
patent: 6483715 (2002-11-01), Chen
patent: 6509779 (2003-01-01), Yue et al.
patent: 6528145 (2003-03-01), Berger et al.
patent: 6533618 (2003-03-01), Aekins
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6563058 (2003-05-01), Mizutani et al.
patent: 6603668 (2003-08-01), Iwanami
patent: 6663946 (2003-12-01), Seri et al.
patent: 6678144 (2004-01-01), Higashi et al.
patent: RE38519 (2004-05-01), Doorhy et al.
patent: 6734542 (2004-05-01), Nakatani et al.
patent: 6799989 (2004-10-01), Doorhy et al.
patent: 6865090 (2005-03-01), Wajima et al.
patent: 6866548 (2005-03-01), Hashim
patent: 6923673 (2005-08-01), Doorhy et al.
patent: 6972893 (2005-12-01), Chen et al.
patent: 6984886 (2006-01-01), Ahn et al.
patent: 7114985 (2006-10-01), Doorhy et al.
patent: 7153168 (2006-12-01), Caveney et al.
patent: 7154049 (2006-12-01), Celella et al.
patent: 7179131 (2007-02-01), Caveney et al.
patent: 7182649 (2007-02-01), Caveney et al.
patent: 7190594 (2007-03-01), Hashim et al.
patent: 7252554 (2007-08-01), Caveney et al.
patent: 7265300 (2007-09-01), Adriaenssens et al.
patent: 7309261 (2007-12-01), Caveney et al.
patent: 7317318 (2008-01-01), Jackson
patent: 7384315 (2008-06-01), Caveney et al.
patent: 7410367 (2008-08-01), Hashim et al.
patent: 7442092 (2008-10-01), Caveney et al.
patent: 7481681 (2009-01-01), Caveney et al.
patent: 7520784 (2009-04-01), Caveney et al.
patent: 7591689 (2009-09-01), Caveney et al.
patent: 2001/0048592 (2001-12-01), Ninomiya
patent: 2002/0088977 (2002-07-01), Mori et al.
patent: 2002/0195270 (2002-12-01), Okubora et al.
patent: 2003/0024732 (2003-02-01), Ninomiya
patent: 2003/0075356 (2003-04-01), Horie
patent: 2003/0119372 (2003-06-01), Aekins
patent: 2003/0174484 (2003-09-01), Pai et al.
patent: 2003/0218870 (2003-11-01), Fisher et al.
patent: 2004/0040740 (2004-03-01), Nakatani et al.
patent: 2004/0082227 (2004-04-01), Hashim
patent: 2004/0147165 (2004-07-01), Celella et al.
patent: 2004/0184247 (2004-09-01), Adriaenssens et al.
patent: 2005/0199422 (2005-09-01), Hashim et al.
patent: 2005/0239340 (2005-10-01), Jackson
patent: 2005/0254223 (2005-11-01), Hashim et al.
patent: 2006/0154531 (2006-07-01), Kim et al.
patent: 2006/0160428 (2006-07-01), Hashim
patent: 2007/0117469 (2007-05-01), Caveney et al.
patent: 2007/0123112 (2007-05-01), Caveney et al.
patent: 2007/0133185 (2007-06-01), Hashim et al.
patent: 2008/0268710 (2008-10-01), Hashim et al.
patent: 1 059 704 (2000-12-01), None
patent: 2 380 334 (2003-04-01), None
patent: 2003086305 (2003-03-01), None
patent: WO 03/019734 (2003-03-01), None
Ragu Natarajan and J.P. Dougherty, “Material Compatibility and Dielectric Properties of Co-Fired High and Low Dielectric Constant Ceramic Packages,” IEEE 1997 Electronic Components and Technology Conference.
Gary D. Alley, “Interdigital Capacitors and Their Application to Lumped-Element Microwave Integrated Circuits,” IEEE Transactions on Microwave Theory and Techniques. 1970. vol. 18, No. 12, p. 1028-1033.
European Search Report for corresponding application No. 05010147.6 dated Jul. 13, 2009.
First Office Action in corresponding Japanese Patent Application No. 2005-140514 mailed Jun. 4, 2010.

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