New maleimide modified epoxy resin and a method for the preparat

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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523466, 525476, 525481, 525482, 525484, 525486, 525487, 525488, 525502, 528 96, 528114, C08L 6300

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054280575

ABSTRACT:
The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), and

REFERENCES:
patent: 4288359 (1981-09-01), Graham
patent: 4871832 (1989-10-01), Saito et al.
patent: 4985529 (1991-01-01), Saito et al.
Abstract of Japanese Laid Open Patent Publication No. 58-215452, dated Dec. 14, 1983, applicant is Toshiba Chemical K.K., inventor is Tsutomu Nagata.
Abstract of Japanese Laid Open Patent Publication No. 59-64660, dated Apr. 12, 1984, applicant is Toshiba Chemical K.K., inventor is Soku Koike.
Abstract of Japanese Laid Open Patent Publication No. 62-53324, dated Mar. 9, 1987, applicant is Agency of Ind. Science & Technology, inventor is Seiichi Hino.
"Biaspartimide-diamines as Curing Agents for Expoy Resins" by Devendra Kumar and Alka D. Gupta, from J. Macromol. Sci.-Chem., A22 (8), pp. 1101-1107, copyright 1985.
"DSC Evaluation of Epoxy and Polyimide-Impregnated Laminates (Prepregs)" by L. T. Pappalardo, from Journal of Applied Polymer Science, vol. 21, pp. 809-820, copyright 1977.

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