Negative resists with high thermal stability comprising end capp

Details Negative resists with high thermal stability comprising end capp Negative resists with high thermal stability comprising end capp

1994-10-27

1996-01-23

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430167, 430194, 430196, 430325, 430330, 430906, G03F 7012, G03F 740

Patent

active

054864470

ABSTRACT:
Cost-effective, negative resists having high thermal stability based on oligomeric and/or polymeric polybenzoxazole precursors are disclosed. Also disclosed are resist solutions having a high level of storage stability when they contain a photoactive component in the form of a bisazide and when the polybenzoxazole precursors are hydroxypolyamides having the following structure: ##STR1## where R, R*, R.sub.1, R.sub.1 * and R.sub.2 are aromatic groups, R.sub.3 is an aromatic group or a norbornene residue, and wherein n.sub.1, n.sub.2 and n.sub.3, are defined as follows:

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IEEE Transactions on Electron Devices, vol. Ed-28 No. 11, Nov. 1981: Azide-Phenolic Resin Photoresists for Deep UV Lithography, Iwayanagi et al., pp. 1306-1310.

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