Negative photosensitive composition and negative...

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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C430S278100, C430S281100, C430S288100, C430S302000

Reexamination Certificate

active

10558956

ABSTRACT:
There are provided a negative-working photosensitive composition which can be cured by infrared rays and is less likely to suffer polymerization inhibition by oxygen during radical polymerization, and also exhibits high adhesion with a metal, and a negative-working photosensitive lithographic printing plate which is capable of directly forming images by irradiation with infrared rays from a solid or semiconductor laser based on digital signals, and also has high sensitivity and excellent printing durability. The negative-working photosensitive composition contains an infrared absorber (A), an organoboron compound (B) which functions as a polymerization initiator by using in combination with the infrared absorber (A), a compound having a polymerizable unsaturated group (C) and a diazo resin (D), and the negative-working photosensitive lithographic printing plate comprises a support, and a photosensitive layer containing the negative-working photosensitive composition formed on the support.

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patent: 5385807 (1995-01-01), Okamoto et al.
patent: 7029820 (2006-04-01), Hotta et al.
patent: 2001/0018164 (2001-08-01), Furukawa
patent: 2002/0177074 (2002-11-01), Hoshi et al.
patent: 101 03 964 (2001-01-01), None
patent: 0 438 123 (1991-07-01), None
JP Abstract 2003-107685 (Apr. 9, 2003).
JP Abstract 2002-287334 (Oct. 3, 2002).
JP Abstract 2001-290271 (Oct. 19, 2001).
JP Abstract 2001-228611 (Aug. 24, 2001).
JP Abstract 2001-226605 (Aug. 21, 2001).
JP Abstract 2000-098603 (Apr. 7, 2000).
JP Abstract 05-194619 (Aug. 3, 1993).
JP Abstract 05-005988 (Jan. 14, 2003).

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