Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...
Reexamination Certificate
2007-09-18
2007-09-18
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating electrolytic or nonelectrolytic coating after it is...
C205S118000, C205S123000, C205S125000, C205S210000, C205S215000, C205S219000
Reexamination Certificate
active
10861756
ABSTRACT:
The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the articles prior to electroplating to provide the electroplatable portions with enhanced electroplatability. This is achieved by passing a current though a near neutral pH solution that contains a conductivity agent and a buffer to reduce or remove surface oxides and contaminants from such portions without deleteriously affecting the non-electroplatable portions of the articles. When the treated surfaces are subsequently subjected to metal plating, a uniform, smooth metal deposit is achieved.
REFERENCES:
patent: 5104494 (1992-04-01), Tench et al.
patent: 6319728 (2001-11-01), Bhan et al.
patent: 2002/0074242 (2002-06-01), Morrissey et al.
patent: 56116726 (1981-09-01), None
Hwang Kilbnam
Schetty, III Robert A.
Technic Inc.
Winston & Strawn LLP
Wong Edna
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