Near-linear spring connect structure for flexible interconnect c

Details Near-linear spring connect structure for flexible interconnect c Near-linear spring connect structure for flexible interconnect c

1986-04-03

1987-11-10

Hartary, Joseph W.

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Markers and/or driving means therefor

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346140R, 439492, G01D 1524

Patent

active

047060972

ABSTRACT:
A printhead for a thermal ink jet printer or the like is brought into good electrical contact with raised electrical contacts on a flexible interconnect circuit by the use of a molded near-linear spring connect structure. This novel structure includes a horizontal central locating member from which a plurality of resilient hollow cylinders extend vertically upward and in alignment with the electrical contacts on the flexible interconnect circuit. Since there is a near-linear deflection of the cylinder walls with increasing force applied thereto, good electrical contact is achieved between the printhead and the flex circuit using a minimum of force, thereby minimizing the likelihood of damage to the printhead.

REFERENCES:
patent: 4116517 (1978-09-01), Selvin
Buck, Roy T.; Printhead Interconnect, Hewlett-Packard Journal, vol. 36, No. 5, May 1985, p. 14.

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