Near-field exposure apparatus and near-field exposure method

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

Reexamination Certificate

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Details

C430S327000, C430S966000, C355S053000, C355S067000, C378S034000, C378S210000

Reexamination Certificate

active

07871744

ABSTRACT:
A near-field exposure apparatus includes a near-field exposure mask and a mechanism places a substrate, to be exposed, opposed to the near-field exposure mask. A mechanism performs relative alignment of the near-field exposure mask and the substrate to be exposed. A mechanism closely contacts the near-field exposure mask and the substrate to be exposed, with each other. A mechanism projects exposure light to the near-field exposure mask, and a soft X-ray irradiating device removes static electricity charged in at least one of the near-field exposure mask and the substrate to be exposed. The soft X-ray irradiating device is disposed such that the near-field exposure mask is located between the soft X-ray irradiating device and the substrate to be exposed.

REFERENCES:
patent: 6090176 (2000-07-01), Yoshitake et al.
patent: 6171730 (2001-01-01), Kuroda et al.
patent: 2000-321777 (2000-11-01), None
patent: 2005-101133 (2005-04-01), None
International Search Report dated Feb. 5, 2008, which was mailed in a Communication dated Feb. 21, 2008, in corresponding International Application No. PCT/JP2007/070220.
Written Opinion of the International Searching Authority mailed Feb. 21, 2008, issued in International Application No. PCT/JP2007/070220.
McNab, S., et al. “Effects of mask materials on near field optical nanolithography,” Materials Research Society Symposium Proceedings, Materials Research Society, Pittsburgh, PA, vol. 705, Nov. 25, 2001, pp. 107-112.
Extended Abstracts (The 53rdSpring Meeting, 2006); The Japan Society of Applied Physics and Related Societies, No. 2, Mar. 22, 2006, p. 757, with translation.

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