Narrow lead contact for automatic face down bonding of electroni

Details Narrow lead contact for automatic face down bonding of electroni Narrow lead contact for automatic face down bonding of electroni

1974-04-29

1976-02-10

James, Andrew J.

357 17, 357 70, 357 74, 357 80, H01L 2328

Patent

active

039381773

ABSTRACT:
A narrow lead contact is disclosed for face down bonding of electronic chips, such as light emitting diodes. The narrow lead and the circuitry associated with the chip or diode is formed on a thin film of transparent insulating material in a conventional manner. The chip is placed face down on the lead on the film and bonded thereto. The bonding can be accomplished by known methods including solder reflow or conductive epoxys. A second lead, which may include a reflector in the case of a light emitting diode, is attached to another point on the chip. When the chip is a light emitting diode, the chip assembly can be encapsulated in a lens system which is attached to both sides of the film. Most of the light emitted from the back and sides of the diode is thus passed out through the film and lens system since the thin lead will preferably obscure less than 35% of the face of the diode. The circuitry formed on the thin film may contain an adjustable resistance to compensate for variations in light intensity. A base circuit, on either rigid or flexible support material, may include whatever circuitry is necessary to enable any specific chip in response to any desired criteria.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3662230 (1972-05-01), Redwantz
patent: 3676668 (1972-07-01), Collins et al.
patent: 3724068 (1973-04-01), Galli
patent: 3763404 (1973-10-01), Aird
patent: 3793714 (1974-02-01), Bylander
patent: 3820153 (1974-06-01), Quinn
patent: 3845318 (1974-10-01), Thillaxs
patent: 3855606 (1974-12-01), Schoberl

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