Naphthol novolac epoxy resin compositions and semiconductor devi

Details Naphthol novolac epoxy resin compositions and semiconductor devi Naphthol novolac epoxy resin compositions and semiconductor devi

1994-01-14

1994-10-25

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 523466, 525481, 525482, 525501, C08L 6106, C08L 6108, C08L 6112, C08K 322, C08K 328

Patent

active

053589807

ABSTRACT:
A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.

REFERENCES:
patent: 5043102 (1991-08-01), Chen
patent: 5096762 (1992-03-01), Yoshida
patent: 5155202 (1992-10-01), Morita

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