Naphthalene ring containing epoxy resin composition and semicond

Details Naphthalene ring containing epoxy resin composition and semicond Naphthalene ring containing epoxy resin composition and semicond

1991-01-24

1993-03-02

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 97, 525476, 525481, 525482, 525487, 523466, C08L 6304

Patent

active

051909952

ABSTRACT:
Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.

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