Naphthalene and or biphenyl skeleton containing epoxy resin comp

Details Naphthalene and or biphenyl skeleton containing epoxy resin comp Naphthalene and or biphenyl skeleton containing epoxy resin comp

1997-02-06

1998-10-27

Wilson, Donald R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523213, 523427, 523440, 523443, 523444, 523457, 523466, C08K 320, C08K 334, C08K 336, C08L 6300

Patent

active

058279083

ABSTRACT:
An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.

REFERENCES:
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patent: 5162400 (1992-11-01), Shiobara et al.
patent: 5166228 (1992-11-01), Shiobara et al.
patent: 5244707 (1993-09-01), Shores
patent: 5298548 (1994-03-01), Shiobara et al.
patent: 5591379 (1997-01-01), Shores
Kirk-Othmer, Encyclopedia of Chemical Technology, 4th ed., John Wiley & Sons, New York, vol. 7, pp. 1031-1045 (1994).

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